DOWSIL SE 9186 is a versatile one-part, flowable moisture-cure silicone adhesive designed for reliable bonding, sealing, and component fixing in modern electronics. Available in black, clear, and white, it cures at room temperature upon exposure to moisture, forming a soft, low‑stress, highly elastic elastomer that delivers exceptional vibration resistance and stress crack protection. With an industry‑leading 8‑minute tack‑free time, it supports high‑throughput in‑line manufacturing without requiring ovens, while its flowable nature enables excellent gap filling, self‑leveling, and coverage across complex geometries. The formulation features ultra‑low volatile siloxane content, significantly reducing risks of contamination, interface issues, or outgassing in sensitive electronic assemblies. It provides reliable unprimed adhesion to metals, glass, ceramics, PCBs, and many plastics, making it ideal for module sealing, PCB component retention, and structural protection. The cured material offers 550% elongation, Shore A 20 softness, and a wide temperature range of -55°C to 200°C, ensuring long‑term stability under thermal cycling, humidity, and mechanical stress. With no added solvents and easy manual or automated dispensing, DOWSIL™ SE 9186 delivers consistent performance, high reliability, and processing efficiency for consumer electronics, industrial modules, and sensitive electrical devices.

• Product Type: One-part RTV silicone adhesive

• Color: Black / Translucent (Clear) / White

• Viscosity: 64,000 cP / 64 Pa·s

• Specific Gravity (cured): 1.03

• Tack-Free Time (25°C): 8 minutes

• Tensile Strength: 2.5 MPa (360 psi)

• Elongation: 550%

• Lap Shear (glass): 1.3 MPa (185 psi)

• Durometer Shore A: 20

• Dielectric Strength: 23 kV/mm (575 volts/mil)

• Volume Resistivity: 2.0×10¹⁶ ohm·cm

• Low Molecular Siloxane (D4–D10): Clear 35 ppm / White 45 ppm

• Low Molecular Siloxane (D4–D20): Clear 230 ppm / White 300 ppm

• Cure Type: Moisture cure (room temperature)

• Heat acceleration: ≤ 60°C

• Operating Temperature: -55°C to +200°C

• One-part, no mixing – ready to use; no solvents, no curing oven needed.

• Fast tack-free at room temperature – 8 minutes for high-speed production.

• Flowable & self-leveling – excellent gap filling, wetting, and coverage.

• Controlled volatility (low siloxane) – minimizes contamination risks in precision electronics.

• Cures to soft, low-stress elastomer – high elongation, anti-crack, and vibration resistance.

• Electronic equipment & module sealing – waterproof and dustproof sealing for housings and assemblies.

• Circuit board component fixing – bonding and securing PCB parts against vibration and shock.

• Stress crack prevention sealing – low‑stress formula protects against thermal cycling cracks.

• Small electronic device assembly – display, sensor, and connector bonding & sealing.

• General electronic potting & coating – lightweight insulation and protection for delicate parts.