ShinEtsu X-23-7868-2D – Advanced Thermal Interface Material for High-Power Components
Ultra-high thermal conductivity (TC) grease, solvent-diluted for flow, offering exceptional heat transfer for high-power electronics and servers.
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PRODUCTS DESCRIPTION
This product represents one of Shin-Etsu's highest performing Thermal Interface Materials. The ultra-fine filler and solvent-diluted composition allow for superior wetting of surfaces and exceptional thermal conductivity (∼6.2 W/m⋅K post-evaporation), critical for dissipating heat from the most demanding power devices.
Products parameters
| Composition: | High thermal conductivity silicone TIM |
| Appearance: | Gray paste |
| Viscosity 25 °C mm²/s: | ~1,500 |
| Specific gravity at 25 °C: | ~2.60 |
| Refractive index at 25 °C: | ~1.425 |
Packaging: | 1KG |
Key features
High thermal conductivity TIM
Reliable under high power load
Stable contact resistance
Excellent pump‑out resistance
Long‑term durability in electronics
Application
Power devices
High‑performance electronics
LED modules
Automotive ECUs
Telecom base stations