HomeProducts Silicone Grease Thermal Conductivity Grease ShinEtsu X-23-7868-2D – Advanced Thermal Interface Material for High-Power Components
ShinEtsu X-23-7868-2D – Advanced Thermal Interface Material for High-Power Components

ShinEtsu X-23-7868-2D – Advanced Thermal Interface Material for High-Power Components

Ultra-high thermal conductivity (TC) grease, solvent-diluted for flow, offering exceptional heat transfer for high-power electronics and servers.
PRODUCTS DESCRIPTION

This product represents one of Shin-Etsu's highest performing Thermal Interface Materials. The ultra-fine filler and solvent-diluted composition allow for superior wetting of surfaces and exceptional thermal conductivity (∼6.2 W/m⋅K post-evaporation), critical for dissipating heat from the most demanding power devices.

Products parameters

Composition: High thermal conductivity silicone TIM
Appearance: Gray paste
Viscosity 25 °C mm²/s: ~1,500
Specific gravity at 25 °C: ~2.60
Refractive index at 25 °C: ~1.425

Packaging: 

1KG












Key features

  • High thermal conductivity TIM

  • Reliable under high power load

  • Stable contact resistance

  • Excellent pump‑out resistance

  • Long‑term durability in electronics

Application
  • Power devices

  • High‑performance electronics

  • LED modules

  • Automotive ECUs

  • Telecom base stations

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