ShinEtsu X-23-7783 D – Screen-Printable Thermal Interface Grease for Power Devices
High thermal conductivity (TC) grease utilizing fine fillers, engineered as a solvent-diluted paste for automated screen/stencil printing applications.
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+852 9408 1652 WhatsApp
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info@innosiltech.com Email
PRODUCTS DESCRIPTION
X-23-7783-D is a high-performance, solvent-diluted Thermal Interface Material (TIM). The diluted format allows for precision application via automated screen or stencil printing, while the solvent evaporates to leave behind a high thermal conductivity path (∼5.5 W/m⋅K) for advanced semiconductor cooling.
Products parameters
| Composition: | Screen‑printable silicone thermal interface material |
| Appearance: | Gray paste |
| Viscosity 25 °C mm²/s: | ~1,000 |
| Specific gravity at 25 °C: | ~2.40 |
| Refractive index at 25 °C: | ~1.420 |
| Packaging: | 1KG |
Key features
Screen‑printable thermal interface material
High thermal conductivity
Easy processability for mass production
Stable contact resistance
Reliable long‑term performance.
Application
Semiconductor packaging
Electronics assembly lines
Power device cooling
LED module thermal management
High‑density circuit boards.
