DOWSIL TC-5888 is a gray, thixotropic, non‑curing thermal interface compound designed for high‑efficiency heat transfer in electronics cooling. It delivers high thermal conductivity and low thermal resistance for reliable thermal management.

• Color: Gray

• Type: One-part, non-curing

• Form: Solvent-free, thixotropic paste

• Specific Gravity: 2.6

• Thermal Conductivity: 5.2 W/m·K

• Thermal Resistance (@25 N/cm²): 0.05 °C·in²/W

• Bond Line Thickness (@25 N/cm²): 0.02 mm (0.0008 in)

• Volatile Content (125°C, 48h): 0.02%

• High thermal conductivity – 5.2 W/m·K enables efficient heat dissipation from high‑power components.

• Non-curing, one-part system – no mixing or curing required; ready to use and easy to rework.

• Solvent-free formulation – stable viscosity over time, consistent screen printing performance.

• Low thermal resistance & ultra-thin BLT – maximizes heat transfer between device and heat sink.

• Thixotropic & low slump – holds shape during assembly, ideal for screen/stencil printing.

• Consumer electronics cooling – transfers heat from CPUs, MPUs, and SoCs to heat sinks.

• Power module cooling – improves heat dissipation for IGBTs, MOSFETs, and power ICs.

• PCB assembly thermal management – reduces operating temperature and boosts reliability.

• Computer & server thermal interface – lowers thermal resistance between processors and heat sinks.

• Compact electronics cooling – supports thin designs in notebooks, compact servers, and embedded systems.