Doesil TC-5351 is a high-performance one-part, non-curing thermally conductive silicone compound engineered for demanding thermal management in automotive and power electronics. It features a high thermal conductivity of 3.3 W/m·K to efficiently transfer heat from heat‑generating components to heat sinks, chassis, or ambient environments, improving device efficiency and service life. With strong thixotropic behavior and excellent vertical stability, the material does not slump or migrate on vertical surfaces and can fill gaps up to 1.0 mm while maintaining consistent thermal performance. Its non-curing, grease-like formulation requires no mixing or heat cure, enabling easy application via automated or manual dispensing and allowing simple rework during assembly or repair. The silicone matrix and thermally conductive fillers provide high-temperature stability, low bleed, and good dielectric performance, making it suitable for high‑voltage and high‑power environments. Designed to meet the reliability requirements of automotive applications, TC-5351 delivers long-term stability under vibration, thermal cycling, and harsh operating conditions, making it a preferred thermal interface material for automotive electronics, power modules, inverters, and industrial power devices.

• Product Type: Thermally Conductive Compound / Thermal Grease

• System: One-part

• Cure Type: Non-curing

• Color: Gray

• Viscosity: 300,000 cP / 300,000 mPa·s / 300 Pa·s

• Thixotropy: 2

• Specific Gravity (uncured): 3.1

• Thermal Conductivity: 3.3 W/m·K (1.9 Btu/hr·ft·°F)

• Dielectric Strength: 6.3 kV/mm (160 volts/mil)

• Volume Resistivity: 3.1×10¹³ ohm·cm

• High thermal conductivity – 3.3 W/m·K supports efficient heat dissipation for high-power devices.

• Excellent vertical stability – stays in place on vertical surfaces without slumping or running.

• Vertical gap-fill up to 1.0 mm – fills gaps while maintaining consistent thermal performance.

• One-part, non-curing formula – no mixing, no curing, ready to use and easy to rework.

• Automotive-grade reliability – stable under harsh temperature and vibration conditions.

• Automotive electronics cooling – thermal management for vehicle control units and powertrain components.

• Power module heat dissipation – efficient thermal interface for IGBT, MOSFET, and inverter modules.

• Vertical surface thermal bonding – ideal for vertical-mounted components and gaps.

• Power electronic device cooling – heat transfer for high-power industrial equipment.

• PCB & chassis thermal interface – reliable heat path between components and housing/heat sinks.