Dowsil TC-5026 is a high-performance gray, flowable, non-curing thermally conductive compound engineered specifically for high-efficiency thermal management in modern computing and consumer electronics. Designed for MPUs, CPUs, and high-performance processors in servers, desktops, notebooks, and game consoles, it combines a polydimethylsiloxane matrix with high‑performance thermally conductive fillers to deliver an outstanding thermal conductivity of 2.9 W/m·K and an ultra-low thermal resistance of only 0.03 °C·cm²/W. Its flowable consistency enables extremely thin bond line thickness (as low as 0.007 mm), creating an ideal thermal bridge between heat‑generating components and heat sinks to maximize cooling efficiency. The one-part, non-curing, solvent-free formulation requires no mixing or curing, simplifying application and supporting high-volume manufacturing. With an ultra-high non-volatile content of 99.95%, the material offers exceptional long-term stability, minimal bleed, and no dry-out, even under continuous high-temperature operation. It provides reliable electrical insulation and stable performance in compact, high-density electronic designs, supporting the trend toward smaller, more powerful devices. DOWSIL™ TC-5026 ensures cooler operation, improved performance, and extended service life for consumer electronics, computing equipment, and high-performance PCB assemblies.

• Product Type: Thermally Conductive Compound / Thermal Grease

• System: One-part

• Cure Type: Non-curing

• Color: Gray

• Viscosity: 100,000 cP / 100,000 mPa·s / 100 Pa·s

• Specific Gravity (uncured): 3.5

• Non-Volatile Content (NVC): 99.95%

• Thermal Conductivity: 2.9 W/m·K (1.7 Btu/hr·ft·°F)

• Thermal Resistance (at 40 psi): 0.03 °C·cm²/W

• Bond Line Thickness (at 40 psi): 0.007 mm / 0.3 mil

• Dielectric Strength: 8.9 kV/mm (227 volts/mil)

• Volume Resistivity: 5.9×10¹¹ ohm·cm

• Dielectric Constant (1 kHz): 7.4

• Dissipation Factor (1 kHz): 0.0003

• Ultra-low thermal resistance – only 0.03 °C·cm²/W for maximum heat transfer efficiency.

• High thermal conductivity – 2.9 W/m·K rapidly cools high‑performance processors.

• Flowable & thin bond line capability – reaches only 0.007 mm for optimal thermal coupling.

• Non-curing, solvent-free formula – no mixing, no curing, stable, no outgassing.

• High non-volatile content – 99.95% NVC ensures long-term stability, no dry-out.

• Server MPU/CPU cooling – high-performance thermal interface for data center processors.

• Desktop & notebook computer cooling – efficient heat dissipation for compact PC systems.

• Game console thermal management – reliable cooling for high‑speed gaming chipsets.

• Consumer electronics thermal coupling – ideal for thin, compact device designs.

• High-performance PCB heat dissipation – lowers operating temperature and improves reliability.