YCR‑9910 is an epoxy‑modified polysilazane resin system designed for room‑temperature construction and curing. The cured film provides high pencil hardness, non‑yellowing performance, and excellent hydrophobicity. It forms strong covalent bonds with substrates, significantly improving mechanical strength, making it ideal for insulation, voltage resistance, wear resistance, anti‑aging, high‑temperature bonding, and structural protection.

• Appearance: Translucent to pale white liquid

• Solid Content: >65% (120±2℃)

• Density (25℃): 0.9±0.02 g/mL

• Pencil Hardness: ≥6H

• Adhesion: Grade 0

• Dielectric Strength: ≥105 V/mm

• Volume Resistivity: ≥10¹³ Ω·m

• Epoxy‑modified polysilazane system

• Room‑temperature or low‑temperature curing

• High adhesion strength >10 MPa

• Excellent insulation and dielectric properties

• Hard, non‑yellowing cured film

• New energy storage module potting and protection

• Electronic component insulation and encapsulation

• High‑temperature structural bonding

• PCB conformal coating and voltage resistance protection

• Anti‑aging coating for electronic devices