HomeProducts Silicone Fluid Polysilazane QuandFeng YCR-9961 - Vinyl-Modified Polysilazane Resin for High Temperature Adhesive, Potting & Coating
QuandFeng YCR-9961 - Vinyl-Modified Polysilazane Resin for High Temperature Adhesive, Potting & Coating

QuandFeng YCR-9961 - Vinyl-Modified Polysilazane Resin for High Temperature Adhesive, Potting & Coating

Vinyl-modified polysilazane resin with dual heat & moisture curing function, long-term withstand 750℃, perfect for high temperature adhesive, potting compound, fiber sizing and metal protective coating.
PRODUCTS DESCRIPTION

QuanFeng YCR-9961 is a professional vinyl-modified polysilazane resin, developed with high-purity polysilazane and vinyl functional modifiers, featuring dual curing performance (heat curing & moisture curing). It cures to form a dense inorganic Si-C-N ceramic layer, delivering stable long-term protection up to 750℃ (short-term peak 900℃), excellent thermal shock resistance and superior anti-corrosion performance. This multifunctional polysilazane resin is widely used as high temperature adhesive, electronic potting compound, fiber sizing agent for carbon/glass fiber, and protective coating for metal substrates, compatible with epoxy, polyester and other resin systems, ideal for aerospace, electronic insulation and advanced composite material manufacturing.

Products parameters

• Type: Vinyl-modified polysilazane resin

• Curing Condition: Heat curing at 200℃~260℃; Room temperature moisture curing

• Long-term working temperature: ≤750℃• Short-term peak temperature: 900℃

• Film hardness: 6H~7H pencil hardness• Adhesion: Grade 0 (cross-cut test)

• Thermal shock resistance: ≥20 cycles (room temperature ↔ 600℃)

• Theoretical coverage: 5–12 m²/kg (coating use)

Key features

• Vinyl-modified formula, excellent compatibility with multiple resin matrix systems

• Dual curing function, supports both heat curing and room temperature moisture curing

• Outstanding high temperature resistance, long-term stable service up to 750℃

• Superior thermal shock resistance, no cracking or peeling under drastic temperature changes

• Multi-functional application, suitable for adhesive, potting, sizing and coating scenarios

• Low viscosity, good wetting and leveling performance for easy construction

• Excellent dielectric insulation, ideal for electronic and electrical applications

• High ceramic yield, perfect as ceramic precursor for advanced ceramic materials

Application

• High temperature resistant adhesive for aerospace and industrial equipment

• Electronic and electrical component potting compound for insulation protection

• Sizing agent for carbon fiber, glass fiber and basalt fiber in composite materials

• High-temperature anti-corrosion coating for stainless steel, alloy steel and metal parts

• Ceramic precursor for Si-C-N ceramic and ceramic matrix composite (CMC) manufacturing

• High-temperature insulation coating for electronic devices and circuit boards

• Anti-oxidation protection for heat treatment fixtures and industrial furnace components

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