X-23-8033-1 is a solvent-diluted thermal grease with excellent thermal conductivity. It forms a white paste with moderate viscosity during application, making it easy to apply and work with. Once the solvent evaporates, it maintains excellent thermal conductivity while forming a stable heat transfer interface, making it suitable for electronic and electrical components requiring efficient heat dissipation. This product offers easy application and excellent uniformity, eliminating the added complexity of complex processes. It also ensures long-term heat dissipation stability, thereby enhancing device reliability and user experience.

• High Thermal Conductivity - X-23-8033-1 boasts a thermal conductivity of approximately 4 W/m·K, enabling higher heat transfer efficiency compared to conventional thermal pastes (typically between 1.0 and 2.5 W/m·K). Its low thermal resistance allows electronic components such as CPUs, GPUs, or power modules to quickly transfer heat to the heat sink, preventing localized overheating. The uniform dispersion of thermally conductive particles within the product ensures excellent thermal conductivity even with thin coatings, ensuring stable operation in high-heat flux environments.

  
  

• Easy Application - With a viscosity of approximately 70 Pa·s, X-23-8033-1 offers moderate flowability, making it easy to apply during dispensing, doctoring, or mass production. Compared to higher-viscosity thermal pastes, X-23-8033-1 exhibits less resistance during application, enabling more uniform coating thickness. Its white paste appearance also facilitates quality inspection, reducing performance fluctuations caused by uneven application. After application, the solvent evaporates, forming a dense and stable thermally conductive layer that does not affect final heat dissipation efficiency.

  
  

• Temperature Stability - X-23-8033-1 maintains stable performance across a wide temperature range of -40°C to 200°C. This thermal barrier maintains reliability, both by preventing material hardening at low temperatures and resisting oxidation and evaporation at high temperatures. Compared to some common thermal greases, which can only withstand temperatures below 150°C, this product offers a wider temperature tolerance range, meeting the stringent requirements of power electronics and equipment operating under long-term full load conditions, thereby extending service life.

• Electronics Industry - In the electronics industry, X-23-8033-1 is primarily used as a heat dissipation interface material for high-heat flux components such as CPUs, GPUs, and power transistors. Its high thermal conductivity of 4 W/m·K significantly improves heat sink efficiency, maintaining device operating temperatures within the designed range, thereby reducing the risk of performance degradation or failure due to overheating. In electronics assembly, this product's ease of installation also improves production efficiency and consistency.

  
  

• Computer Industry - In the computer industry, this product is suitable for cooling systems in servers, laptops, and high-performance computers. As chip power consumption continues to increase, traditional thermally conductive materials are no longer sufficient. X-23-8033-1's high thermal conductivity and temperature stability effectively handle long-term operation and high-load conditions, maintaining operational stability. Particularly in data center environments, its reliable heat dissipation can help reduce overall energy consumption and extend hardware life.

  
  

• Power Industry - In the power industry, this product is commonly used for thermal management of power modules, inverters, and high-voltage electrical equipment. These devices generate significant heat during operation, and inadequate heat dissipation can lead to reduced efficiency or even damage. The X-23-8033-1 offers excellent thermal conductivity and a temperature resistance of up to 200°C, meeting the demands of continuous operation in high-power environments. Its stability ensures low thermal resistance during long-term operation, reducing maintenance costs.