Shin-Etsu G-747 is a professional-grade thermal conductive silicone grease developed for CPU thermal conduction, semiconductor components, and power devices that require both effective heat dissipation and reliable electrical insulation. This white paste-type grease provides a stable, uniform thermal interface between heat-generating components and heat sinks, ensuring efficient thermal transfer while maintaining high dielectric strength. It features excellent oxidative stability and resistance to temperature fluctuations, remaining consistent even during prolonged exposure to heat or humidity, making it an ideal choice for resin-encapsulated power transistors.

• Heat and Cold Resistance - Shin-Etsu G747 maintains superior performance across a wide temperature range from -50°C to 150°C, ensuring consistent viscosity and structure under extreme conditions. Laboratory testing shows that after continuous exposure at 150°C for 1000 hours, oil separation remained below 0.3%. 

  
  

• Moisture Resistance - The product demonstrates exceptional resistance to moisture and humidity. After being placed in an environment of 95% relative humidity for 168 hours, G-747 retained more than 98% of its dielectric strength, and no internal structural change was observed.

  
  

• Safety - G-747 uses a chemically inert silicone base that is non-corrosive and non-toxic. In the ASTM D130 copper corrosion test, it achieved a 1a rating, indicating no corrosive effects on metal surfaces. Even after long-term exposure at elevated temperatures, it produces no harmful gases or residues. 

  
  

• Efficiency - Shin-Etsu G747 delivers excellent heat transfer efficiency even with minimal application. With a thermal conductivity value of 0.9 W/m·K, it ensures fast and uniform heat dissipation from the heat source to the sink. 

  
  

• Water Repellency - The silicone base of G-747 ensures excellent adhesion to surfaces and strong resistance to washout by water or pressure flow. Even when submerged, it maintains its consistency and does not separate or dissolve. 

• Electric & Electronics - Shin-Etsu G747 is widely used in electrical and electronic assemblies, including power modules, CPUs, and LED drivers, where it provides a stable thermal interface between heat-generating components and metal heat sinks. It enhances system reliability by maintaining consistent heat transfer, and tests show that its application can lower component temperatures by 6–8°C, thereby reducing thermal stress and extending equipment longevity.

  
  

• Semiconductor - In semiconductor manufacturing and encapsulation, G-747 serves as an effective interface material for transistors, thermistors, and other heat-conducting elements. With a dielectric strength of 15 kV/mm, it provides both insulation and efficient thermal conduction, preventing electrical leakage while maintaining low junction temperatures.

  
  

• Wind Power - G-747 is suitable for heat conduction and insulation in wind turbine control systems and inverter modules. Its excellent oxidation resistance allows stable operation over extended service cycles under high wind-induced vibration and temperature variation. The consistent thermal conductivity ensures effective dissipation of heat from high-power converters, reducing energy loss and improving operational stability in renewable energy systems.