SylGard™ 170 is a liquid silicone encapsulant that cures to a flexible elastomer ideal for protecting electrical and PCB assemblies. It cures at a uniform rate without exotherm, regardless of thickness or confinement, and requires no post-cure-allowing immediate use after curing. The material offers excellent flow and gap-filling properties, making it suitable for complex geometries. Standard grades require primer and surface cleaning for adhesion, while primerless versions adhere with cleaning alone.

• Low Viscosity Flow - SylGard™ 170 exhibits a typical viscosity range of 1,500–2,500 cP at 25°C, allowing it to penetrate narrow gaps and fill complex assemblies without trapping air. This flowability enables uniform potting thickness even in high-density component layouts. Viscosity measurements using ASTM D1084 confirm stable flow behavior during extended working times.

  
  

• Long Working Window - The material provides a working life of more than 60 minutes at 25°C, validated through gel-time evaluation. This extended window supports manual filling, automated dosing, and multi-stage assembly processes without premature thickening. It helps reduce material waste and ensures operators can stabilize parts before final cure.

  
  

• Thermal Performance - SylGard™ 170 offers a thermal conductivity around 0.27 W/m·K, supporting heat movement away from power components during operation. Thermal cycling studies show stable mechanical performance up to 150°C, ensuring reliability in applications where continuous heating and cooling stresses occur. These properties make it suitable for thermally active modules.

  
  

• Flame-Retardant Safety - Tested to UL 94 V-0 and compliant with MIL-PRF-23586F for select tested grades, SylGard™ 170 meets strict flame-retardant and electrical safety criteria. These certifications demonstrate its ability to maintain protective integrity under ignition or fault conditions, supporting high-reliability equipment. Its flame-resistant elastomer layer enhances long-term safety margins.

  
  

• Versatile Cure Profile - SylGard™ 170 cures at room temperature or via accelerated cycles such as 1 hour at 100°C, supporting multiple production speeds. Its non-exothermic cure behavior prevents thermal stress on sensitive components. Controlled cure kinetics ensure consistent hardness and elasticity across different batch sizes and casting thicknesses.

• Power Supplies - Used for potting AC/DC and DC/DC conversion modules where vibration, dust, and moisture exposure may affect electronic stability. SylGard™ 170 forms a protective barrier that prevents conductive paths and environmental degradation. It enhances long-term power module reliability in industrial and consumer equipment.

  
  

• Connectors - Applied around connector joints to protect metallic contacts from corrosion, moisture entry, and particulate contamination. Its elastic cured mass absorbs mechanical strain during plug-and-unplug cycles. This ensures stable signal transmission, especially in connector systems used in harsh operating environments.

  
  

• Sensors - Suitable for pressure, position, and thermal sensor assemblies requiring stress-relief encapsulation. The elastomeric nature of SylGard™ 170 minimizes mechanical stress transfer to sensing elements. This stabilizes calibration values, particularly in sensors exposed to temperature cycling or vibration loads.

  
  

• Industrial Controls - Provides protective encapsulation for control boards, interface modules, and monitoring circuits commonly installed in factories. The encapsulated layer shields circuitry from oils, humidity, metal dust, and electrical noise. Its long-term stability supports continuous operation in demanding industrial automation environments.

  
  

• Transformers - Encapsulates coils and internal windings to prevent partial discharge and moisture-induced insulation breakdown. SylGard™ 170 forms a resilient dielectric mass that resists electrical tracking. This helps maintain performance in compact or high-voltage transformer designs subjected to thermal load cycling.

  
  

• Amplifiers - Used in audio and RF amplifier modules where component isolation is needed to avoid mechanical resonance and interference. The uniform silicone layer minimizes vibration transmission and stabilizes electronic performance. Its controlled elasticity supports high-precision circuits sensitive to micro-movements.

  
  

• High-Voltage Resistor Packs - Provides insulation for HV resistor networks, reducing the risk of arcing, corona formation, or surface leakage. SylGard™ 170 ensures stable dielectric spacing across resistor arrays. Its durability helps maintain consistent resistance values under repeated high-load conditions.

  
  

• Relays - Suitable for protecting electromechanical relay coils and internal switching mechanisms. The encapsulant prevents dust and contaminant intrusion while maintaining mobility of mechanical parts. Its environmental resistance ensures relays operate reliably even in equipment subjected to shock or rapid cycling.