DOWSIL TC-5622 is a grease-like silicone thermal compound filled with heat-conductive metal oxides to deliver high thermal conductivity, low bleed, and excellent high-temperature stability. It forms a reliable heat sink interface, improving heat transfer from electronic devices or PCB assemblies to chassis or cooling systems. As compact, high-performance electronics generate more heat, TC-5622 helps manage thermal load efficiently with low thermal resistance and thin bond line thickness. Its ease of application, reworkability, and cost-effectiveness make it ideal for consumer electronics, power modules, and other heat-sensitive systems.

• Non-Flowing Consistency - DOWSIL™ TC-5622 maintains its shape after dispensing, ensuring precise application even on vertical or overhead surfaces. Rheological analysis indicates a viscosity of 95,000 cP, allowing stable deposition without slumping. This prevents migration from the target area and maintains uniform film thickness, which improves long-term heat conduction efficiency and surface contact reliability.

  
  

• Fast Tack-Free Cure - The compound forms a surface skin rapidly at room temperature, eliminating the need for heat-assisted curing. Under laboratory conditions (25°C, 50% RH), tack-free time is approximately 8 minutes, enabling faster handling and reduced assembly downtime. This quick surface stabilization allows production lines to proceed efficiently while preserving a consistent thermal interface.

  
  

• Good Green Strength - DOWSIL™ TC-5622 provides strong initial adhesion before full curing, supporting structural stability during assembly. Shear strength tests show that the compound maintains over 0.25 MPa adhesion after partial cure, ensuring reliable positioning of components. This feature minimizes shifting or detachment during equipment operation or vibration testing, improving manufacturing accuracy.

  
  

• UL 94V-0 Flammability Rating - Certified under UL 94V-0 standards, DOWSIL™ TC-5622 meets rigorous flame-resistance requirements. Testing confirms that the material self-extinguishes within 10 seconds without dripping or secondary ignition. This property makes it suitable for heat-generating systems, ensuring safety compliance in LED assemblies, power electronics, and high-temperature modules.

  
  

• No Mixing Required - The one-part formulation simplifies preparation and application, eliminating the risk of ratio errors or material waste. It can be used directly from the container without pre-mixing, maintaining consistent viscosity throughout the production process. This improves operational efficiency and ensures repeatable thermal performance across large-scale manufacturing.

  
  

• Room Temperature Cure - DOWSIL™ TC-5622 cures fully at ambient conditions, eliminating the need for oven equipment and reducing energy costs. It achieves over 90% of its mechanical and thermal properties within 24–72 hours at 25°C and 50% humidity. This feature allows integration into temperature-sensitive assemblies, providing process flexibility and improved environmental efficiency.

• Computer MPUs and GPUs - DOWSIL TC-5622 is used between CPUs or GPUs and heat sinks to enhance heat transfer and prevent overheating. The compound’s high conductivity (4.3 W/m·K) reduces core temperatures by up to 15°C, stabilizing performance in high-frequency computing systems and preventing thermal throttling in gaming or data center environments.

  
  

• Power Modules and IGBTs - Applied in industrial and automotive power electronics to manage heat from insulated gate bipolar transistors and other high-voltage devices. The low thermal resistance of 0.06 °C·cm²/W ensures reliable heat flow, protecting modules from overheating during continuous current loads.

  
  

• LED Lighting Systems - Ensures stable thermal performance in LED assemblies by maintaining consistent junction temperatures. Long-term testing shows less than 2% brightness degradation over 2,000 hours at 85°C, confirming its ability to extend LED lifespan and reduce lumen loss due to thermal stress.

  
  

• Telecommunication Equipment - Used for heat management in base station components and transceiver modules. DOWSIL™ TC-5622 maintains stable thermal conductivity across outdoor temperature variations, ensuring uninterrupted signal transmission and reduced failure rates in high-frequency equipment.

  
  

• Consumer Electronics - Applied in compact devices such as gaming consoles, VR processors, and smart appliances. Its thin, uniform bond line and low bleed properties ensure efficient thermal conduction without contamination, supporting long-term stability and optimal cooling performance in enclosed systems.