ShinEtsu KER-4405 - One-Component UV Addition Cure Silicone Adhesive for Electronic Assembly & Bonding
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ShinEtsu KER-4405 is a high-performance, one-component UV addition cure silicone adhesive designed for electronic assembly applications. It features a unique step-cure system: partial curing under UV light (365 nm) enables temporary fixation and reversible processing, followed by full room-temperature cure. This transparent silicone offers low cure shrinkage, excellent electrical insulation, and strong adhesion to metals, plastics, glass, and ceramics—ideal for precision bonding in wearable devices, sensors, and consumer electronics.
Products parameters
• Model: KER-4405
• Curing Type: One-component UV addition cure (delayed step cure)
• UV Cure Conditions: 3,000 mJ/cm² (365 nm UV-LED) + 23°C × 24 h post-cure
• Appearance: Transparent liquid
• Viscosity: 3–5 Pa·s
• Hardness (Shore A): 5–10
• Linear Shrinkage: ≤0.3%
• Volume Resistivity: ≥1.0×10¹⁴ Ω·cm
• Dielectric Strength: ≥20 kV/mm
Key features
• One-component formula eliminates mixing, simplifies production handling
• Delayed step-cure system: temporary UV fixation + full room-temperature cure
• Reversible processing after UV irradiation allows correction or rework
• Low cure shrinkage (≤0.3%) for precise bonding of delicate components
• Transparent cured material enables visual inspection of assemblies
• Excellent electrical insulation properties for reliable electronic performance
• Good adhesion to multiple substrates (metals, plastics, glass, ceramics)
• Flexible, soft elastomer with low stress on sensitive parts
• Temporary and permanent bonding of wearable electronic components
• Sensor assembly requiring reversible processing or visual inspection
• Precision bonding of plastic/metal parts in consumer electronics
• Sealing and encapsulation of delicate electronic modules
• UV-assisted assembly of devices with heat-sensitive components