KE-66 is a two-part condensation-cure RTV silicone rubber formulated for room-temperature potting and encapsulation of electronic assemblies. Supplied as a viscous liquid system that is mixed prior to use, it flows evenly around components and maintains stable handling during dispensing and leveling. During curing, KE-66 transitions smoothly into an elastic rubber with consistent body and surface finish, giving users predictable processing behavior and reliable results across repeated production batches without complex process adjustments.

• Dielectric Protection - KE-66 provides stable electrical insulation after cure, supporting sensitive electronic assemblies. Typical volume resistivity exceeds 1 × 10¹⁴ ohm·cm, while dielectric strength commonly reaches above 20 kV per mm. These values help ensure reliable insulation performance under continuous electrical load and varying environmental conditions.

  
  

• Moisture Barrier - After full cure, KE-66 forms a dense silicone network that limits moisture penetration. Water absorption typically remains below 0.5 percent by weight after 24 hours of immersion at room temperature. This barrier performance supports long-term protection of encapsulated components in humid or condensation-prone environments.

  
  

• Chemical Stability - KE-66 demonstrates resistance to common industrial fluids such as oils, mild solvents, and cleaning agents. Weight change after 72 hours of exposure to standard mineral oils or industrial fluids is typically below 1 percent. This stability helps preserve mechanical and electrical properties during long-term service.

  
  

• Elastic Integrity - The cured elastomer maintains flexibility while preserving structural integrity. Typical elongation at break exceeds 200 percent, and Shore A hardness generally falls in the range of 25 to 35. These characteristics allow stress relief around components caused by thermal expansion or vibration.

  
  

• Thermal Endurance - KE-66 maintains stable performance over a wide service temperature range. Mechanical and electrical properties are typically retained between −50 °C and 180 °C. This thermal stability supports use in electronics exposed to temperature cycling or elevated operating conditions.

  
  

• Process Consistency - KE-66 offers predictable curing behavior when mixed at the specified ratio. Pot life typically ranges from 30 to 60 minutes at 23 °C, while full cure is achieved within 24 hours depending on section thickness. This consistency supports controlled production timing and repeatable encapsulation quality.

• Electronics Potting - KE-66 is used to pot electronic circuits and assemblies requiring long-term electrical insulation. Typical potting depths of 10 to 30 mm can cure evenly at room temperature. The cured material supports stable electrical performance and mechanical protection of components.

  
  

• Module Encapsulation - In electronic module encapsulation, KE-66 provides uniform coverage around densely packed components. Its flow behavior allows void reduction during dispensing, supporting consistent encapsulation quality. This helps protect modules from environmental exposure and mechanical stress.

  
  

• Sensor Sealing - KE-66 is applied to seal sensors used in moisture-exposed environments. After cure, the silicone maintains insulation resistance above 1 × 10¹³ ohm·cm. This supports reliable signal stability and long-term sensor operation.

  
  

• Automotive Electronics - KE-66 is suitable for protecting automotive electronic units subject to vibration and temperature variation. The cured elastomer accommodates mechanical movement while maintaining insulation integrity. Typical service conditions align with common automotive electronic requirements.

  
  

• Industrial Equipment - In industrial equipment, KE-66 is used to seal and insulate control units and electronic housings. Its chemical resistance supports exposure to oils and industrial atmospheres. Predictable curing behavior supports consistent production results.