ShinEtsu KE-1885 - Single-Component Heat-Cure Silicone Adhesive for Electronic Sealing & Bonding
-
+852 9408 1652 WhatsApp
-
info@innosiltech.com Email
ShinEtsu KE-1885 is a high-performance, single-component heat-cure silicone adhesive/sealant formulated for durable bonding and sealing. When cured, it forms a tough, flexible elastomer with excellent unprimed adhesion to metals, plastics, glass, and ceramics. Designed for electronic and industrial applications, it offers reliable protection against moisture, vibration, and thermal stress, while maintaining stable electrical properties across a wide temperature range.
Products parameters
• Curing Type: Single-component heat cure
• Appearance: White high-viscosity liquid
• Shear Strength: 2.0 MPa
• Usable Temperature Range: -40°C to +180°C
• Volume Resistivity: 10.0 TΩ·m
Key features
• Single-component formula for easy, one-step application with no mixing required
• Strong unprimed adhesion to metals, plastics, glass, and ceramics
• High-viscosity consistency for gap-filling and vertical surface stability
• Tough, durable elastomer with excellent vibration and impact resistance
• Stable electrical properties for reliable insulation in electronic assemblies
• Wide operating temperature range (-40°C to +180°C) for long-term performance
• Heat-cure system enables fast, controlled curing in production environments
• Electronic component sealing and potting for moisture and dust protection
• Automotive electronic assembly bonding and sealing
• Industrial equipment sealing for vibration and thermal stress resistance
• Bonding of metal, plastic, glass, and ceramic parts in consumer electronics
• General-purpose industrial sealing requiring high durability and electrical insulation