DOWSIL™ SE 9189 L is a room-temperature moisture-cure silicone adhesive that forms a soft, low-stress elastomer ideal for electronics. It cures without ovens in 30–80% humidity, reaching over 90% of its properties within 24–72 hours. With fast handling time (10–120 minutes) and optional mild heat acceleration, it supports efficient processing. The material cures from the surface inward and is best suited for open or shallow applications. Its stable properties, flame resistance (UL 94 V-0), and solvent-free formulation make it reliable for protecting sensitive components in electronic assemblies.

• Fast Curing Efficiency - DOWSIL™ SE 9189 L cures quickly at room temperature under 30–80% relative humidity, forming a surface skin within 8 minutes and achieving over 90% of its mechanical properties within 24–72 hours. Verified through ISO 9046 testing, this fast curing profile improves manufacturing throughput by enabling quicker handling and reduced cycle times, especially in automated production environments.

  
  

• Flowable Consistency - The silicone’s viscosity of 22,000 cP ensures smooth, consistent flow and controlled spreadability. This enables accurate application in narrow gaps and intricate electronic assemblies. Testing under ASTM D1084 confirms that it maintains uniform distribution without air entrapment, optimizing precision and minimizing rework in automated or manual dispensing processes.

  
  

• Low-Stress Elasticity - Once cured, the material forms a soft elastomer with Shore A hardness of approximately 20–25 and elongation above 300%, based on ASTM D412 measurements. This flexible structure relieves mechanical stress on delicate circuit boards and solder joints, ensuring electrical and structural stability even under thermal cycling and vibration.

  
  

• Certified Flame Resistance - The material meets UL 94 V-0 flammability classification, extinguishing within 10 seconds after ignition and limiting flame propagation to under 10 mm. These results, confirmed by UL certification testing, ensure suitability for safety-critical electronics and assemblies requiring fire-resistant insulation.

  
  

• Low Volatility Control - DOWSIL™ SE 9189 L is formulated with controlled siloxane molecular weight to minimize low-molecular-weight silicone migration. Outgassing tests following ASTM E595 show total mass loss below 0.8%, making it safe for use in enclosed or contamination-sensitive environments such as electronic modules and optical systems.

  
  

• Solvent-Free Formula - The product contains no added solvents or low-boiling additives, ensuring minimal VOC emissions during processing. Gas chromatography analysis confirms total volatile content below 0.5%, contributing to cleaner workplace conditions and improved environmental compliance for manufacturers.

  
  

• No-Heat Processing - The adhesive requires no oven curing, functioning entirely under ambient humidity. This reduces production energy consumption and equipment costs by over 20%, as verified through internal process efficiency assessments. Its reliable room-temperature curing behavior supports flexible integration into continuous production lines.

• Electronics Manufacturing - DOWSIL™ SE 9189 L is used for sealing and bonding on circuit boards, sensors, and electronic modules. Its soft elastomer layer protects components from vibration and thermal expansion while ensuring stable electrical insulation, extending the reliability of PCB assemblies in long-term operation.

  
  

• Telecommunication Equipment - Applied in bonding and sealing of telecom enclosures and connectors, the adhesive’s UL 94 V-0 flame rating and low volatility ensure safe performance in environments requiring electrical insulation and resistance to thermal aging.

  
  

• Automotive Electronics - Used for vibration control and component bonding in under-hood and cabin systems. Its low modulus and flexibility allow it to absorb mechanical stress from engine vibration and temperature fluctuation, maintaining secure adhesion in high-performance vehicle electronics.

  
  

• Industrial Controls - Ideal for sealing sensors and control boards exposed to heat, dust, and mechanical load. The 8-minute tack-free cure accelerates assembly processes, while the flowable consistency ensures complete sealing of complex geometries.

  
  

• Consumer Appliances - Utilized for bonding and insulating electronic components within home and industrial appliances. Its solvent-free formulation, low smoke emission, and thermal stability up to 180°C ensure long-term safety and electrical reliability in high-usage environments.