Dowsil SE 4486 is a highly practical one-part moisture-cure thermally conductive silicone adhesive designed for reliable thermal management in home appliances and electronic modules. It cures at room temperature upon exposure to moisture to form a durable, low-stress elastomer with non-corrosive byproducts, making it safe for heat-sensitive components and printed circuit boards. With a thermal conductivity of 1.6 W/m·K, it effectively creates a thermal bridge to transfer heat away from heat-generating devices to heat sinks or outer housings, improving operation efficiency and extending product service life. Its semi-flowable texture enables smooth, uniform application via manual or automated dispensing, while the industry-leading 4-minute tack-free time greatly improves production efficiency and throughput. The material offers strong unprimed adhesion to many common substrates including glass, aluminum, ceramics, and epoxy PCBs, eliminating the need for primers in most applications. It delivers stable performance across a wide temperature range from -45°C to 200°C, resisting thermal cycling and maintaining flexibility and bonding strength in long-term use. With low volatility and stable formulation, DOWSIL™ SE 4486 is an ideal thermal bonding solution for home appliances, consumer electronics, and small electronic modules.

• Product Type: Thermally Conductive Adhesive

• System: One-part

• Cure Type: Moisture cure (RTV, room temperature cure)

• Color: White

• Viscosity: 19,600 cP (19.6 Pa·s)

• Fluidity: 60 mm (2.32 inches)

• Specific Gravity (cured): 2.6

• Tack-Free Time (25°C): 4 minutes

• Tensile Strength: 3.9 MPa (570 psi / 40 kg/cm²)

• Elongation: 43%

• Durometer Shore A: 81

• Unprimed Lap Shear (glass-to-glass): 1.65 MPa (240 psi / 165 N/cm²)

• Thermal Conductivity: 1.6 W/m·K (0.92 BTU/hr·ft·°F)

• Operating Temperature Range: -45°C to +200°C

• One-part ready to use – no mixing required, simplifies production and assembly.

• Ultra-fast tack-free time – only 4 minutes at 25°C for high-speed manufacturing.

• Semi-flowable consistency – easy to dispense and apply automatically or manually.

• Good primerless adhesion – reliable bonding to glass, metals, ceramics, PCBs, and plastics.

• Stable thermal conductivity – provides consistent heat dissipation for electronic devices.

• Home appliance thermal bonding – heat dissipation for control boards, compressors, and motors.

• Small electronic module cooling – thermal interface for compact household devices.

• PCB assembly thermal management – heat transfer from components to heat sinks or chassis.

• Consumer electronics bonding – durable thermal glue for small household electronics.

• General electronic module assembly – structural bonding with thermal conduction for stable performance.