DOWSIL SE 4485 is a high-performance one-part moisture-cure thermally conductive silicone adhesive engineered for reliable thermal management and structural bonding in electronic modules. It cures at room temperature upon exposure to moisture to form a low-stress, durable elastomer with non-corrosive byproducts, making it ideal for heat-sensitive components. With a thermal conductivity of 2.8 W/m·K, it efficiently transfers heat away from high-power devices to heat sinks or chassis, improving performance and extending service life. Its semi-flowable consistency enables easy manual or automated dispensing, while the fast 10‑minute tack‑free time supports high-throughput manufacturing. The formula features ultra-low volatility (99.2% NVC) and is UL 94 V‑0 rated for enhanced safety in lighting, telecom, and power supply applications. It provides strong unprimed adhesion to metals, glass, ceramics, and printed circuit boards without the need for surface primers in most cases. Suitable for thin‑section bonding and encapsulation, DOWSIL™ SE 4485 delivers stable performance across a wide temperature range from -45°C to 200°C, ensuring long‑term reliability under thermal cycling and harsh operating conditions.

• Product Type: Thermally Conductive Adhesive

• System: One-part

• Cure Type: Moisture cure (RTV, room temperature cure)

• Color: White

• Fluidity: 54 mm (2.1 inches)

• Specific Gravity (cured): 2.9

• Non-Volatile Content (NVC): 99.2%

• Tack-Free Time (25°C): 10 minutes

• Tensile Strength: 3.4 MPa (492 psi / 34.6 kg/cm²)

• Durometer Shore A: 90

• Unprimed Lap Shear (glass‑to‑glass): 1.2 MPa (168 psi / 120 N/cm²)

• Dielectric Strength: 19 kV/mm (483 volts/mil)

• Thermal Conductivity: 2.8 W/m·K (1.62 BTU/hr·ft·°F)

• Flame Rating: UL 94 V‑0 recognized

• One-part, ready-to-use – no mixing required, ideal for high-speed production.

• Fast tack‑free time – 10 minutes at room temperature for improved processing efficiency.

• High thermal conductivity (2.8 W/m·K) – excellent heat transfer from components to heat sinks or housings.

• UL 94 V‑0 flame retardant – safe for use in lighting, telecom, and consumer electronics.

• Strong unprimed adhesion – reliable bonding to glass, metals, ceramics, PCBs, and plastics.

LED lamp & lighting module thermal bonding – heat dissipation for LED drivers and light sources.

Telecom equipment assembly – thermal management for communication modules and circuit boards.

Power supply & adapter cooling – secure bonding with efficient heat transfer for power devices.

PCB & electronic component assembly – durable thermal bonding for compact electronic systems.

Consumer electronics cooling – safe, flame‑retardant thermal interface for household devices

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