DOWSIL SE 4450 is a professional two-part heat-cure thermally conductive silicone adhesive designed for high-strength thermal bonding and efficient heat dissipation in demanding electronics. Featuring primerless adhesion, zero cure by-products, deep-section curing capability, and excellent thermal conductivity, it is widely used in power modules, automotive electronics, PCB assemblies, semiconductor cooling, and industrial device applications. Its long pot life and high-temperature stability make it ideal for high-volume automated manufacturing and long‑life electronic systems.

• Product Type: Thermally Conductive Adhesive

• System: Two-part (addition cure)

• Cure Type: Heat-cure (no by-products)

• Color: Gray / White (standard)

• Cure Condition: 100°C or above; 15 mins at 150°C for thin sections

• Lap Shear Strength: 3.45 MPa

• Thermal Conductivity: ~1.2 W/m·K (typical)

• Dielectric Strength: 22 kV/mm

• Viscosity: 560 poise

• Specific Gravity: ~2.4

• Non-Volatile Content: ~99%

• Operating Temperature: -45°C to +200°C

• Heat-cure addition system – no cure by-products, supports deep-section & fully confined bonding.

• Primerless strong adhesion – excellent bonding to metals, ceramics, PCBs, and filled plastics.

• High thermal conductivity – efficient heat transfer from components to heat sinks or chassis.

• Long pot life & stable processing – wide processing window for automated production.

• Wide temperature stability – durable performance from -45°C up to 200°C for long-term use.

• Power module thermal bonding – high-performance cooling for IGBT, MOSFET, and inverter modules.

• Automotive electronics assembly – reliable thermal bonding for engine and powertrain components.

• Deep-section potting & bonding – ideal for enclosed, confined, or thick adhesive sections.

• PCB & semiconductor cooling – heat dissipation for high-power ICs and electronic assemblies.

• Industrial electronic devices – durable thermal management for automation and control equipment.