DOWSIL SE 4420 - Thermally Conductive Adhesive, for Thermal Management in Telecom and Power Modules
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One-part ready-to-use – no mixing required, simplifies automated or manual dispensing.
Fast tack-free time – 8 minutes at 25°C for high processing efficiency.
Thermally conductive formula – effectively dissipates heat from heat-generating devices.
Strong unprimed adhesion – excellent bonding to aluminum and many electronic substrates.
Low-stress, durable elastomer – stable performance across wide temperature ranges.
Products parameters
Product Type: Thermally Conductive Adhesive
System: One-part
Cure System: Moisture cure (RTV)
Color: White
Fluidity: 48 mm (1.9 inches)
Specific Gravity (cured): 2.26
Non-Volatile Content (NVC): 98%
Tack-Free Time (25°C): 8 minutes
Key features
One-part ready-to-use – no mixing required, simplifies automated or manual dispensing.
Fast tack-free time – 8 minutes at 25°C for high processing efficiency.
Thermally conductive formula – effectively dissipates heat from heat-generating devices.
Strong unprimed adhesion – excellent bonding to aluminum and many electronic substrates.
Low-stress, durable elastomer – stable performance across wide temperature ranges.
Telecom module thermal bonding – heat dissipation for communication modules.
Power supply device cooling – thermal interface and bonding for power electronics.
PCB thermal management – heat transfer from heat sources to heat sinks.
Compact consumer electronics – thermal bonding in slim, high‑performance devices.
Electronic module assembly – structural bonding with thermal conduction capability.
